CL178C0104GBC [KYOCERA AVX]

Film Capacitor, Polyphenylene Sulphide, 25V, 2% +Tol, 2% -Tol, 100000uF, Surface Mount, 5040;


型号：	CL178C0104GBC
厂家：	KYOCERA AVX
描述：	Film Capacitor, Polyphenylene Sulphide, 25V, 2% +Tol, 2% -Tol, 100000uF, Surface Mount, 5040
文件：	总3页 (文件大小：106K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Film Chip Capacitors

How to Order, Dimensions and Construction

HOW TO ORDER

0104

Type

CB: SMD Lead Free

Size

Dielectric

2 = PET-HT

8 = PPS

Voltage

B = 16V

C = 25V

D = 50/63V

E = 100V

G = 250V

I = 400V

Capacitance

1st digit: 0

Tolerance

EIA Code

G⁽¹⁾= 2%

J = 5%

Suffix Packaging

-- = bulk

BA = tape & reel

diameter: 180mm

BC = tape & reel

diameter: 330mm

01: 1206

02: 1210

03: 1812

04: 2220

05: 2824

95: 2840

16: 4030

17: 5040

18: 6054

2nd & 3rd: the 2nd

significant figures of the

capacitance value.

4th digit: the number of

zeros to be added to the

capacitance value.

7 = PEN

K = 10%

K = 630V

Example of an order: How to order a chip film PET-HT 100nF 10% 250V bulk packaging.

⁽¹⁾: Tolerance G available only for PPS Series.

CASE DIMENSIONS: millimeters (inches)

Size Code

Equivalent size

1206

Length (L)

Width (W)

Termination Return

0.50 0.30 (0.020 0.012)

0.60 0.40 (0.024 0.157)

0.80 0.60 (0.032 0.024)

3.30 0.30 (0.130 0.012)

4.50 0.50 (0.177 0.020)

5.80 0.50 (0.228 0.020)

7.20 0.50 (0.283 0.020)

10.5 0.60 (0.413 0.024)

12.8 0.60 (0.504 0.024)

15.3 0.60 (0.602 0.024)

1.60 0.30 (0.063 0.012)

2.50 0.30 (0.098 0.012)

3.20 0.50 (0.126 0.020)

5.00 0.50 (0.197 0.020)

6.10 0.50 (0.240 0.020)

10.0 0.80 (0.343 0.031)

7.60 0.80 (0.299 0.031)

10.2 0.80 (0.401 0.031)

13.7 0.80 (0.539 0.031)

1210

1812

2220

2824

2840

4030

5040

6054

STACKED FILM CONSTRUCTION

Our SMD Film capacitors (CB series) are using stacked tech-

nology with metallized plastic film, which forms the basis for

the capacitive element. Combined with the nacked design

choice, it gives our products an again better self-healing

capability as well as a very good capacitance per volume

ratio. This also means that internal construction of the multi-

layer stack, usually hidden in encapsulated film capacitors

design, is visible at the cut edges in the surface mount con-

figuration. In a typical film capacitor stack, hundreds of film

layers are compacted during manufacture. Under a micro-

scope these have the appearance of pages in a book.

Subsequent manufacturing and pcb assembly processes

allow a small amount of relaxation in these layers. In some

cases, small gaps between layers may become visible. These

are referred to as microgaps, and their occurrence is a stan-

dard feature of this technology. Even if it can be considered

an cosmetic issue, presence of these gaps has no effect at all

on mechanical or electrical performance or reliability. (Detailed

report is available upon request.)

Film Chip Capacitors

Electrical Properties and Test Conditions – CB Series

STANDARDIZATION

Reference Standard is CECC 32201

Test

Capacitance C

Description

Measurement frequency 1 KHz 20°C

Performance

Shall be within tolerance of the rated value

DF < 100.10^-4

Dissipation Factor DF

Insulation Resistance IR

Measurement frequency 1 KHz 20°C

Voltage applied:

10V for Vr < 100V

100V for Vr > = 100V

IR > 1000 Mohms for C < = 0.33µF

IR x C > 400sec. For C > 0.33µF

Dielectric Strength

Mounting

Surge Voltage = 1.4Vr applied

for 1mm between terminals

There shall be no direct breakdown

Board = 1.6mm (0.063") thick epoxy

glass laminated or alumine substrate

C = within 2% of initial value

DF = < = 50.10^-4at 1 KHz

IR = within initial limit

Adhesion

Force of 5 N applied for 10 secs.

No visible damage

Board Bending Test

Bending of 1 mm(0.039")

for 90 mm (3.543") length

C = within 2% of initial value

No visible damage

Thermal Shock

500 cycles –55/+125°C

40°C 93% RH / no voltage / 56 days

85ºC 85% RH 1.5V-500H

C = within 5% of initial value

ESR = no more than 3 times initial value

IR = not less than 50% of the initial limit

Damp Heat

Steady State

C = within 7% of initial value

Delta DF = < 50.10^-4at 1 KHz

IR = not less than 50% of the initial limit

Accelerated Damp Heat

(Load Humidity)

C = within 7% of initial value

Delta DF = < = 70.10^-4at 1 KHz

IR = not less than 50% of the initial limit

Life Test

85ºC / 1.25Vr / 1000H

C = within 8% of initial value

Delta DF = < 50.10^-4at 1 KHz

IR = not less than 50% of the initial limit

105°C / Vr/1,000 Hours

125°C / Vr/1,000 Hours

C = within 7% of initial value

Delta DF = < 50.10^-4at 1 KHz

IR = not less than 50% of the initial limit

Charge/Discharge

10,000 cycle / Vr

C = within 5% of initial value

DF = < 50.10^-4at 1 KHz

IR = not less than 50% of the initial limit

Film Chip Capacitors

Packaging – CB Series

TAPE & REEL DIMENSIONS

4.00 (0.157)

0.10 (0.004)

1.75 (0.069)

0.15 (0.006)

+0.10

-0

2.00 (0.079)

0.05 (0.002)

1.50 (0.059)

Direction of unreeling

13.0 (0.512)

0.50 (0.020)

RECOMMENDATIONS

TAPE & REEL CHARACTERISTICS

Once the sealed bag is opened, the capacitors must be

stored in a dry atmosphere until soldering.

In accordance with IEC 286 and EIA 481, the material used:

Carrier tape: Antistatic Material

Cover tape: Polyester

Recommended storage conditions are:

Reel: Recyclable Material

PET & PEN: < 30°C and R.H.<60% for a maximum of

168 hours

Parts in bulk or on reel are packed in hermetically sealed

plastic bags.

PPS:

< 30°C and R.H.<60% for a maximum of

4 weeks

The use-by date is 3 years if kept in origin plastic bags.

In case of storage outside the conditions recommended

above the capacitors must be dried prior to soldering.

Recommended drying conditions are:

48 hours minimum at 60°C and RH < 10%.

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